BAE Systems has been selected by the US Department of Defense (DoD) to qualify a new generation of integrated circuit technology for use in the harsh environment of space.
The new 12 nanometre technology provides a dramatic leap forward in space-based computing compared to current 45 nanometre technology.
Courtesy BAE Systems
BAE Systems has been selected by the Department of Defense (DoD) to qualify a new generation of integrated circuit technology for use in the harsh environment of space.
The new 12 nanometre technology uses a smaller feature size that provides a dramatic leap forward in space-based computing compared to current 45 nanometre technology.
“This selection makes BAE Systems the premier radiation-hardened integrated circuit supplier for space customers,” said Ricardo Gonzalez, director of Space Systems at BAE Systems. “Moving from a 45 nanometre design to a 12 nanometre design enables more transistors to fit on each chip at reduced power consumption per operation, which increases functionality – an important factor in space vehicles, where volume and power are limited resources.”
Space missions require high-performance but low-power integrated circuits with special design features to mitigate the effects of radiation. The 12 nanometre, radiation-hardened, or RH12 technology, will be tested to Qualified Manufacturer’s Listing (QML) Class V and Q standards, key industry certifications for reliable parts. BAE Systems will offer RH12 integrated circuit development and production services to the industry with a flexible engagement model.
As a world leader in developing, manufacturing and deploying state-of-the-art, radiation-hardened circuits for use in defence, space, intelligence, research and commercial missions, BAE Systems is ready to deliver integrated circuit technology for missions in challenging environments. The company’s integrated circuits are produced by its Space Systems group in Manassas, Va., a DoD Category 1A Microelectronics Trusted Source, covering design, aggregation, broker, assembly, packaging and test services.